The Gelid GP-Extreme TP-GP05-D thermal pad is an ideal choice for applications requiring a flexible material with high thermal conductivity. It is used in water blocks, RAM modules, power circuits, and SMD components.

• Thermal conductivity: 12 W/m-K
• Hardness (Shore): 35 OO
• Density: 2.8 g/cm3
• Dimensions: 120x20 mm
• Thickness: 2 mm
• Not electrically conductive
• Does not cause corrosion, does not harden, and is non-toxic

Its soft structure makes it suitable for components with irregular shapes or different heights, filling gaps from tiny cracks to noticeable irregularities.